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TCM811/TCM812
4-Pin Reset Monitors
Features
* Precision VDD Monitor for 2.0V, 2.8V, 3.0V, 3.3V, 5.0V Nominal Supplies * Manual Reset Input * 140 ms Minimum RESET Output Duration * RESET Output Valid to VDD = 1.0V (TCM811) * Low 6 A (typ.) Supply Current * VDD Transient Immunity * Small 4-Pin SOT-143 Package * No External Components * Replacement for MAX811/812 and Offers a Lower Threshold Voltage Option * Push-Pull RESET Output * Temperature Range: - Commercial (C) -40C to +85C
General Description
The TCM811 and TCM812 are cost effective system supervisory circuits designed to monitor V DD in digital systems and provide a reset signal to the host controller when necessary. A manual reset input is provided to override the reset monitor and is suitable for use as a push-button reset. No external components are required. The reset output is driven active within 20 s (5 s for F version) of VDD falling through the reset voltage threshold. RESET is maintained active for a minimum of 140 ms after VDD rises above the reset threshold. The TCM812 has an active high RESET output while the TCM811 has an active low RESET output. The output of the TCM811 is valid down to VDD = 1V. Both devices are available in a 4-Pin SOT-143 package, specified with a temperature range of -40C to +85C. The TCM811/TCM812 are optimized to reject fast transient glitches on the VDD line. A low supply current of 6 A (VDD = 3.3V) makes these devices ideal for battery powered applications.
Applications
* * * * Computers Embedded Systems Battery Powered Equipment Critical Microcontroller Power Supply Monitoring
Package Types:
SOT-143 4 TCM811 or TCM812 VDD
Typical Application Circuit
VDD 0.1F
VDD
TCM811 3 MR 2
4
VDD
PIC Microcontroller RESET INPUT (Active Low) GND
GND 1
PUSH BUTTON
RESET GND
TCM811 RESET TCM812 (RESET)
2
3
MR
(c) 2007 Microchip Technology Inc.
DS21615C-page 1
TCM811/TCM812
1.0 ELECTRICAL CHARACTERISTICS
*Notice: Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage (VDD to GND)........................................+6.0V RESET, RESET.................................... - 0.3V to (VDD + 0.3V) Input Current, VDD ........................................................20 mA Output Current, RESET, RESET...................................20 mA Operating Temperature Range......................- 40C to +85C Storage Temperature Range .......................- 65C to +150C Maximum Junction Temperature, TS.............................. 150C
ELECTRICAL CHARACTERISTICS
VDD = 5V for L/M versions, VDD = 3.3V for T/S versions, VDD = 3V for R version, VDD = 2.0V for F version. Unless otherwise noted, TA = -40C to +85C. Typical values are at TA = +25C. (Note 1) Parameters VDD Range Supply Current Sym VDD ICC Min 1.0 1.1 -- -- Reset Threshold VTH 4.54 4.50 4.30 4.25 3.03 3.00 2.88 2.85 2.58 2.55 1.71 1.70 Reset Threshold Tempco VDD to Reset Delay -- -- -- Reset Active Timeout Period MR Minimum Pulse Width MR Glitch Immunity MR to Reset Propagation Delay tMD tRP tMR 140 10 -- -- Typ -- -- 6 4.75 4.63 -- 4.38 -- 3.08 -- 2.93 -- 2.63 -- 1.75 -- 30 20 5 280 -- 100 0.5 Max 5.5 5.5 15 10 4.72 4.75 4.46 4.50 3.14 3.15 2.98 3.00 2.68 2.70 1.79 1.80 -- -- -- 560 -- -- -- Units V A A V V V V V V V V V V V V ppm/ C s s ms s ns s VDD = VTH to VTH -125 mV; TCM81_L/M VDD = VTH to VTH -125 mV; TCM81_R/S/T/F VDD = VTH(MAX) TCM811 TCM812 TCM81_L/M, VDD = 5.5V, IOUT = 0 TCM81_R/S/T/F, VDD = 3.6V, IOUT = 0 TCM81_L: TA = +25C TA = -40C to +85C TCM81_M: TA = +25C TA = -40C to +85C TCM81_T: TA = +25C TA = -40C to +85C Conditions
TCM81_S: TA = +25C TA = -40C to +85C TCM81_R: TA = +25C TA = -40C to +85C TCM81_F: TA = +25C TA = -40C to +85C
Note 1: Production testing done at TA = +25C and +85C, overtemperature limits are tested with periodic QA tests in production.
DS21615C-page 2
(c) 2007 Microchip Technology Inc.
TCM811/TCM812
VDD = 5V for L/M versions, VDD = 3.3V for T/S versions, VDD = 3V for R version, VDD = 2.0V for F version. Unless otherwise noted, TA = -40C to +85C. Typical values are at TA = +25C. (Note 1) Parameters MR Input Threshold Sym VIH VIL MR Pull-up Resistance RESET Output Voltage Low (TCM811) VOL Min 2.3 0.7 VDD -- -- 10 -- -- -- Typ -- -- -- -- 20 -- -- -- Max -- -- 0.8 0.25 VDD 40 0.3 0.4 0.3 Units V V V V k V V V TCM811R/S/T only; ISINK = 1.2 mA, VDD = VTH(MIN) TCM811F only; ISINK = 500 A, VDD = VTH(MIN) TCM811L/M only; ISINK = 3.2 mA, VDD = VTH(MIN) ISINK = 3.2 mA, VDD = VTH(MIN) TCM811R/S/T/F only; ISOURCE = 500 A, VDD > VTH(MAX) TCM811L/M only; ISOURCE = 800 A, VDD > VTH(MAX) TCM812F only, ISINK = 500 A, VDD = VTH(MAX) TCM812R/S/T only, ISINK = 1.2 mA, VDD = VTH(MAX) TCM812L/M only, ISINK = 1.2 mA, VDD = VTH(MAX) ISOURCE = 150 A, VDD VTH(MIN) Conditions VDD > VTH(MAX), TCM81_L/M VDD > VTH(MAX), TCM81_R/S/T/F VDD > VTH(MAX), TCM81_L/M VDD > VTH(MAX), TCM81_R/S/T/F
RESET Output Voltage High (TCM811)
VOH
0.8 VDD VDD - 1.5
-- -- -- -- -- --
-- -- 0.2 0.3 0.4 --
V V V V V V
RESET Output Voltage Low (TCM812)
VOL
-- -- --
RESET Output Voltage High (TCM812)
VOH
0.8 VDD
Note 1: Production testing done at TA = +25C and +85C, overtemperature limits are tested with periodic QA tests in production.
(c) 2007 Microchip Technology Inc.
DS21615C-page 3
TCM811/TCM812
2.0
Note:
TYPICAL PERFORMANCE CHARACTERISTICS
The graphs provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
8 TCM81xR/S/T/F No Load SUPPLY CURRENT (A) 6 VDD = 5V 4
14 12 SUPPLY CURRENT (A) 10 8 6 4 VDD = 1V 2 0 -40 VDD = 5V VDD = 3V
TCM81xL/M No Load
VDD = 3V VDD = 1V
2
-20
0
20
40
60
85
0 -40
-20
0
20
40
60
85
TEMPERATURE (C)
TEMPERATURE (C)
FIGURE 2-1:
50 POWER-DOWN RESET DELAY (sec)
Supply Current vs. Temperature.
FIGURE 2-4:
50
Supply Current vs. Temperature.
TCM81xF 40 30 VOD = 20 mV 20
POWER-DOWN RESET DELAY (sec)
VOD = 20 mV 40 VOD = 100 mV VOD = 200 mV
30
20
10 VOD = 100 mV 0 -40 VOD = 200 mV -20 0 20 40 60 85
10 TCM81xL/M 0 -40 -20 0 20 40 60 85
TEMPERATURE (C)
TEMPERATURE (C)
FIGURE 2-2: Temperature.
250 POWER-UP RESET TIMEOUT (msec)
Power-Down
Reset
Delay
vs.
FIGURE 2-5: Temperature.
50 POWER-DOWN RESET DELAY (sec)
Power-Down
Reset
Delay
vs.
TCM81x/R/S/T
245 TCM81xL/M 240 TCM81xR/S/T/F
40
30
235
20
VOD = 200 mV VOD = 100 mV VOD = 20 mV
230
10
225 -40
-20
0
20
40
60
85
0 -40
-20
0
20
40
60
85
TEMPERATURE (C)
TEMPERATURE (C)
FIGURE 2-3: Temperature.
Power-Up
Reset
Timeout
vs.
FIGURE 2-6: Temperature.
Power-Down
Reset
Delay
vs.
DS21615C-page 4
(c) 2007 Microchip Technology Inc.
TCM811/TCM812
1.0030 NORMALIZED THRESHOLD (V) 1.0020
1.0010 1.0000 0.9990 0.9980 0.9970 0.9960 0.9950 0.9940 -40 -15 35 10 TEMPERATURE (C) 60 65
FIGURE 2-7: Temperature.
Normalized
Reset
Threshold
vs.
(c) 2007 Microchip Technology Inc.
DS21615C-page 5
TCM811/TCM812
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No. 1 2 2 3 4
PIN FUNCTION TABLE
Symbol GND RESET (TCM811) RESET (TCM812) MR VDD Ground RESET push-pull output remains low while VDD is below the reset voltage threshold, and for at least 140 ms (min.) after VDD rises above reset threshold Reset push-pull output remains high while VDD is below the reset voltage threshold, and for at least 140 ms (min.) after VDD rises above reset threshold Manual Reset input generates a Reset when MR is below VIL Supply voltage Description
3.1
Ground Terminal (GND)
3.4
Manual Reset (MR)
GND provides the negative reference for the analog input voltage. Typically, the circuit ground is used.
3.2
Reset Output (RESET) (TCM811)
RESET output remains low while VDD is below the Reset voltage threshold (VTRIP). Once the device voltage (VDD) returns to a high level (VTRIP + VHYS), the device will remain in Reset for the Reset delay timer (TRST). After that time expires, the RESET pin will be driven to the high state.
The Manual Reset (MR) input pin allows a push button switch to easily be connected to the system. When the push button is depressed, it forces a system Reset. This pin has circuitry that filters noise that may be present on the MR signal. The MR pin is active-low and has an internal pull-up resistor.
3.5
Supply Voltage (VDD)
3.3
Reset Output (RESET) (TCM812)
VDD can be used for power supply monitoring or a voltage level that requires monitoring.
RESET output remains high while VDD is below the Reset voltage threshold (VTRIP). Once the device voltage (VDD) returns to a high level (VTRIP + VHYS), the device will remain in Reset for the Reset delay timer (TRST). After that time expires, the RESET pin will be driven to the low state.
DS21615C-page 6
(c) 2007 Microchip Technology Inc.
TCM811/TCM812
4.0 APPLICATIONS INFORMATION
The TCM811/TCM812 provides accurate VDD monitoring and reset timing during power-up, powerdown, and brownout/sag conditions. These devices also reject negative-going transients (glitches) on the power supply line. Figure 4-1 shows the maximum transient duration vs. maximum negative excursion (overdrive) for glitch rejection. Any combination of duration and overdrive that is under the curve will not generate a reset signal. Combinations above the curve are detected as a brownout or power-down. Transient immunity can be improved by adding a 0.1 F capacitor in close proximity to the VDD pin of the TCM811/ TCM812. such that it does not appreciably load RESET under normal operation (100 k will be suitable for most applications). Similarly, a pull-up resistor to VDD is required for the TCM812 to ensure a valid high RESET for VDD below 1.1V. VDD
4 0.1F
VDD TCM811 2 RESET R1 100 k
VDD
GND
VTH
Overdrive = VD D
1
Duration
MAXIMUM TRANSIENT DURATION (sec)
FIGURE 4-2: The addition of R1 at the RESET output of the TCM811 ensures that the RESET output is valid to VDD = 0V.
400
TA = +25C
4.2
320
Controllers and Processors With Bidirectional I/O Pins
240
160 TCM81xL/M 80 TCM81xR/S/T 0 1 10 1000 100 RESET COMPARATOR OVERDRIVE, VTH - VDD (mV)
Some microcontrollers have bidirectional reset pins. Depending on the current drive capability of the controller pin, an indeterminate logic level may result if there is a logic conflict. This can be avoided by adding a 4.7 k resistor in series with the output of the TCM811/TCM812 (Figure 4-3). If there are other components in the system which require a reset signal, they should be buffered so as not to load the reset line. If the other components are required to follow the reset I/O of the microcontroller, the buffer should be connected as shown with the solid line.
Buffered RESET To Other System Components BUFFER VDD 4 0.1F TCM811 4.7 k RESET GND 1 2 RESET GND Micro controller
FIGURE 4-1: Maximum Transient Duration vs. Overdrive for Glitch Rejection at +25C.
4.1
RESET Signal Integrity During Power-Down
The TCM811 RESET push-pull output is valid to VDD = 1.0V. Below this voltage the output becomes an "open circuit" and does not sink current. This means CMOS logic inputs to the microcontroller will be floating at an undetermined voltage. Most digital systems are completely shutdown well above this voltage. However, in situations where RESET must be maintained valid to VDD = 0V, a pull-down resistor must be connected from RESET to ground to discharge stray capacitances and hold the output low (Figure 4-2). This resistor value, though not critical, should be chosen
FIGURE 4-3: Interfacing the TCM811 to a Bidirectional Reset I/O.
(c) 2007 Microchip Technology Inc.
DS21615C-page 7
TCM811/TCM812
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
1
&
2
= part number code + reset threshold voltage (two-digit code) (V) 4.63 4.38 3.08 2.93 2.63 1.75 (V) 4.63 4.38 3.08 2.93 2.63 1.75 TCM811 Code U1 U2 U3 U4 U5 U7 TCM812 Code V1 V2 V3 V4 V5 V7
Part Number TCM811LERCTR TCM811MERCTR TCM811TERCTR TCM811SERCTR TCM811RERCTR TCM811FERCTR Part Number TCM812LERCTR TCM812MERCTR TCM812TERCTR TCM812SERCTR TCM812RERCTR TCM812FERCTR
3 4
1
234
represents year and two-month period code represents production lot ID code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information.
5.2
Taping Form
Device Marking
User Direction of Feed
Pin 1
W, Width of Carrier Tape
Pin 1 Standard Reel Component Orientation
P, Pitch Reverse Reel Component Orientation
for TR Suffix Device (Mark Right Side Up) Package 4-Pin SOT-143 Carrier Width (W) 8 mm Pitch (P) 4 mm Part Per Full Reel 3000 Reel Size 7 in.
DS21615C-page 8
(c) 2007 Microchip Technology Inc.
TCM811/TCM812
4-Lead Plastic Small Outline Transistor (RC) [SOT-143]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
D e e/2 N
E E1
1 e1
2
A
A2
c
A1
b2
3X b
L1
L
Units Dimension Limits Number of Pins Pitch Pin1 Offset Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness Lead 1 Width Leads 2, 3 & 4 Width N e e1 A A2 A1 E E1 D L L1 c b1 b 0 0.08 0.76 0.30 0.80 0.75 0.01 2.10 1.20 2.67 0.13 MIN
MILLIMETERS NOM 4 1.92 BSC 0.20 BSC - 0.90 - - 1.30 2.90 0.50 0.54 REF - - - - 8 0.20 0.94 1.22 1.07 0.15 2.64 1.40 3.05 0.60 MAX
0.54 Notes: 1. Significant Characteristic. 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-031B
(c) 2007 Microchip Technology Inc.
DS21615C-page 9
TCM811/TCM812
NOTES:
DS21615C-page 10
(c) 2007 Microchip Technology Inc.
TCM811/TCM812
APPENDIX A: REVISION HISTORY
Revision C (February 2007)
* Section 5.0 "Packaging Information": Corrected SOT-143 packaging information. * Section 3.0 "Pin Descriptions": Added pin descriptions. * Added disclaimer on package outline drawing. * Updated package outline drawing. * Section 1.0 "Electrical Characteristics": Reformatted Electrical Characteristics
Revision B (January 2002)
* Undocumented changes.
Revision A (October 2001)
* Original Release of this Document.
(c) 2007 Microchip Technology Inc.
DS21615C-page 11
TCM811/TCM812
NOTES:
DS21615C-page 12
(c) 2007 Microchip Technology Inc.
TCM811/TCM812
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X X XXXX Package Examples:
a) b) c) d) e) f) a) b) c) d) e) f) TCM811LERCTR: TCM811MERCTR: TCM811TERCTR: TCM811SERCTR: TCM811RERCTR: TCM811FERCTR: TCM812LERCTR: TCM812MERCTR: TCM812TERCTR: TCM812SERCTR: TCM812RERCTR: TCM812FERCTR: 4.63V 4.38V 3.08V 2.93V 2.63V 1.75V 4.63V 4.38V 3.08V 2.93V 2.63V 1.75V
VDD Temperature Reset Range Threshold
Device:
TCM811: 4-Pin P Reset Monitor (RESET low) TCM812: 4-Pin P Reset Monitor (RESET high) L M T S R F E = = = = = = 4.63V 4.38V 3.08V 2.93V 2.63V 1.75V
Threshold Voltage: (typical)
Temperature Range: Package:
= -40C to +85C
RCTR =
Plastic Small Outline Transistor (RC) SOT-143, 4 lead, (tape and reel).
(c) 2007 Microchip Technology Inc.
DS21615C-page 13
TCM811/TCM812
NOTES:
DS21615C-page 14
(c) 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2007 Microchip Technology Inc.
DS21615C-page 15
WORLDWIDE SALES AND SERVICE
AMERICAS
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ASIA/PACIFIC
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EUROPE
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12/08/06
DS21615C-page 16
(c) 2007 Microchip Technology Inc.

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